Generic VLSI platform for system-level optical interconnection insertion

Lawrence Anthony Hornak; Stuart K. Tewksbury

doi:10.1117/12.174513

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2 May 1994 Generic VLSI platform for system-level optical interconnection insertion

Lawrence Anthony Hornak, Stuart K. Tewksbury

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Proceedings Volume 2153, Optoelectronic Interconnects II; (1994) https://doi.org/10.1117/12.174513
Event: OE/LASE '94, 1994, Los Angeles, CA, United States

Abstract

A barrier that has faced insertion of optical interconnections within MCM environments is the absence of generic system-level building blocks suitable for inclusion by system designers within prototype MCM architectures. To obtain system-level acceptance, a stable digital interface with built-in self test, fault tolerance, and relaxation of optomechanical alignment must be provided. To accommodate the rapid technology development implied by chip level requirements, these generic components must provide this system-level stability while also acting as a technology platform from which new generations of optical components and integrated packaging can be evaluated. This paper describes design considerations for a prototype intelligent optical interconnection module (IOIM) to serve as this generic system- level building block. The utility of the IOIM organization is motivated through exploration of the requirements of an optoelectronic interface for a cryo-electronic communication switch prototype.

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Lawrence Anthony Hornak and Stuart K. Tewksbury "Generic VLSI platform for system-level optical interconnection insertion", Proc. SPIE 2153, Optoelectronic Interconnects II, (2 May 1994); https://doi.org/10.1117/12.174513

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