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2 May 1994 Hybrid integration of electrical and optical interconnects
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Proceedings Volume 2153, Optoelectronic Interconnects II; (1994) https://doi.org/10.1117/12.174526
Event: OE/LASE '94, 1994, Los Angeles, CA, United States
Abstract
In this paper, we describe a novel approach for fabrication of low-cost optoelectronic modules for optical interconnect applications. The concept includes: (1) placement of optical and electrical components on a common substrate using a chip-first MCM structure to improve thermal handling capabilities, (2) fabrication of both optical and electrical interconnects using planar processes compatible to standard IC processes in manufacturing to reduce nonrecurring engineering costs, and (3) application of adaptive interconnect for device-to-waveguide alignment to reduce recurring packaging costs. Preliminary results on waveguide fabrication and modeling of adaptive interconnect are discussed in this paper.
© (1994) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yung-Sheng Liu, Herbert S. Cole, Julian P. G. Bristow, and Yue Liu "Hybrid integration of electrical and optical interconnects", Proc. SPIE 2153, Optoelectronic Interconnects II, (2 May 1994); https://doi.org/10.1117/12.174526
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