Planned development of a 3D computer based on free-space optical interconnects

John A. Neff; David R. Guarino

doi:10.1117/12.174520

2 May 1994 Planned development of a 3D computer based on free-space optical interconnects

John A. Neff, David R. Guarino

Proceedings Volume 2153, Optoelectronic Interconnects II; (1994) https://doi.org/10.1117/12.174520
Event: OE/LASE '94, 1994, Los Angeles, CA, United States

Abstract

Free-space optical interconnection has the potential to provide upwards of a million data channels between planes of electronic circuits. This may result in the planar board and backplane structures of today giving away to 3-D stacks of wafers or multi-chip modules interconnected via channels running perpendicular to the processor planes, thereby eliminating much of the packaging overhead. Three-dimensional packaging is very appealing for tightly coupled fine-grained parallel computing where the need for massive numbers of interconnections is severely taxing the capabilities of the planar structures. This paper describes a coordinated effort by four research organizations to demonstrate an operational fine-grained parallel computer that achieves global connectivity through the use of free space optical interconnects.

Citation Download Citation

John A. Neff and David R. Guarino "Planned development of a 3D computer based on free-space optical interconnects", Proc. SPIE 2153, Optoelectronic Interconnects II, (2 May 1994); https://doi.org/10.1117/12.174520

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