Self-alignment by flip-chip bonding for OE-MCM packaging

Susant K. Patra; Jian Ma; Volkan H. Ozguz; Sing H. Lee

doi:10.1117/12.174501

2 May 1994 Self-alignment by flip-chip bonding for OE-MCM packaging

Susant K. Patra, Jian Ma, Volkan H. Ozguz, Sing H. Lee

Proceedings Volume 2153, Optoelectronic Interconnects II; (1994) https://doi.org/10.1117/12.174501
Event: OE/LASE '94, 1994, Los Angeles, CA, United States

Abstract

The impact of process variation associated with lateral and axial misalignment of flip-chip solder joint based assembly for OE-MCM packaging is analyzed through quasi-static force balance in the system. The effect of variation in solder deposition height, vertical loading, and surface tension coefficient on the alignment, and therefore on the optical performance of the system, is studied.

Citation Download Citation

Susant K. Patra, Jian Ma, Volkan H. Ozguz, and Sing H. Lee "Self-alignment by flip-chip bonding for OE-MCM packaging", Proc. SPIE 2153, Optoelectronic Interconnects II, (2 May 1994); https://doi.org/10.1117/12.174501

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