Modeling of solvent evaporation effects for hot plate baking of photoresist

Chris A. Mack; David P. DeWitt; Benjamin K. Tsai; Gil Yetter

doi:10.1117/12.175372

16 May 1994 Modeling of solvent evaporation effects for hot plate baking of photoresist

Chris A. Mack, David P. DeWitt, Benjamin K. Tsai, Gil Yetter

Proceedings Volume 2195, Advances in Resist Technology and Processing XI; (1994) https://doi.org/10.1117/12.175372
Event: SPIE's 1994 Symposium on Microlithography, 1994, San Jose, CA, United States

Abstract

A heat transfer model for hotplate baking is combined with a mass transfer model for solvent diffusion to predict the major effects of photoresist prebaking for photolithography. Solvent diffusivity as a function of solvent concentration and temperature is determined experimentally. The results of the model are a complete time-temperature history of the wafer, final solvent distribution within the resist film, and final resist thickness.

Citation Download Citation

Chris A. Mack, David P. DeWitt, Benjamin K. Tsai, and Gil Yetter "Modeling of solvent evaporation effects for hot plate baking of photoresist", Proc. SPIE 2195, Advances in Resist Technology and Processing XI, (16 May 1994); https://doi.org/10.1117/12.175372

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