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16 May 1994 Modeling of solvent evaporation effects for hot plate baking of photoresist
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Abstract
A heat transfer model for hotplate baking is combined with a mass transfer model for solvent diffusion to predict the major effects of photoresist prebaking for photolithography. Solvent diffusivity as a function of solvent concentration and temperature is determined experimentally. The results of the model are a complete time-temperature history of the wafer, final solvent distribution within the resist film, and final resist thickness.
© (1994) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Chris A. Mack, David P. DeWitt, Benjamin K. Tsai, and Gil Yetter "Modeling of solvent evaporation effects for hot plate baking of photoresist", Proc. SPIE 2195, Advances in Resist Technology and Processing XI, (16 May 1994); https://doi.org/10.1117/12.175372
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