Paper
1 May 1994 On-line photolithography modeling using spectrophotometry and Prolith/2
Herbert L. Engstrom, Jeanne E. Beacham
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Abstract
Spectrophotometry has been applied to optimizing photolithography processes in semiconductor manufacturing. For many years thin film measurement systems have been used in manufacturing for controlling film deposition processes. The combination of film thickness mapping with photolithography modeling has expanded the applications of this technology. Experimental measurements of dose-to-clear, the minimum light exposure dose required to fully develop a photoresist, are described. It is shown how dose-to-clear and photoresist contrast may be determined rapidly and conveniently from measurements of a dose exposure matrix on a monitor wafer. Such experimental measurements may underestimate the dose-to- clear because of thickness variations of the photoresist and underlying layers on the product wafer. Online modeling of the photolithographic process together with film thickness maps of the entire wafer can overcome this problem. Such modeling also provides maps of dose-to- clear and resist linewidth that can be used to estimate and optimize yield.
© (1994) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Herbert L. Engstrom and Jeanne E. Beacham "On-line photolithography modeling using spectrophotometry and Prolith/2", Proc. SPIE 2196, Integrated Circuit Metrology, Inspection, and Process Control VIII, (1 May 1994); https://doi.org/10.1117/12.174147
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Cited by 1 scholarly publication.
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KEYWORDS
Optical lithography

Spectrophotometry

Photoresist materials

Semiconducting wafers

Deposition processes

Manufacturing

Semiconductor manufacturing

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