High-contrast selective deposition of metal thin films and their properties as semiconductor contacts

Koichi Toyoda; Koji Sugioka; Satoshi Takeuchi

doi:10.1117/12.184736

7 September 1994 High-contrast selective deposition of metal thin films and their properties as semiconductor contacts

Koichi Toyoda, Koji Sugioka, Satoshi Takeuchi

Proceedings Volume 2207, Laser Materials Processing: Industrial and Microelectronics Applications; (1994) https://doi.org/10.1117/12.184736
Event: Europto High Power Lasers and Laser Applications V, 1994, Vienna, Austria

Abstract

High-contrast selective deposition of copper (Cu) and gold (Au) thin films using succeeding plating processes after the KrF excimer laser direct doping is described. Contrast ratio of selective deposition is estimated to be 10⁸ for gallium arsenide (GaAs). As the properties of the deposition, resistivity of deposition and contact resistance to semiconductor are studied. A submicron line-pattern is formed by KrF excimer laser projection direct doping. Cu thin films are deposited selectively on the doped region by electroplating using a CuSO₄ aqueous solution. For Au, the electroless plating using a commercial Au-24s solution has been carried out. The low specific contact resistance of 4.95 X 10^-6 (Omega) cm² between Au and GaAs which is 1/150 as small as that of the conventional alloyed contacts is achieved.

Citation Download Citation

Koichi Toyoda, Koji Sugioka, and Satoshi Takeuchi "High-contrast selective deposition of metal thin films and their properties as semiconductor contacts", Proc. SPIE 2207, Laser Materials Processing: Industrial and Microelectronics Applications, (7 September 1994); https://doi.org/10.1117/12.184736

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