You have requested a machine translation of selected content from our databases. This functionality is provided solely for your convenience and is in no way intended to replace human translation. Neither SPIE nor the owners and publishers of the content make, and they explicitly disclaim, any express or implied representations or warranties of any kind, including, without limitation, representations and warranties as to the functionality of the translation feature or the accuracy or completeness of the translations.
Translations are not retained in our system. Your use of this feature and the translations is subject to all use restrictions contained in the Terms and Conditions of Use of the SPIE website.
5 April 1995Microchannel-based optical backplane demonstrators using FET-SEED smart pixel arrays
David V. Plant,1 B. R. Robertson,1 Harvard Scott Hinton,1 Guillaume C. Boisset,1 N. H. Kim,1 Yong Sheng Liu,1 M. R. Otazo,1 D. R. Rolston,1 Alain Z. Shang,1 William M. Robertson1
We have demonstrated a representative portion of an optical backplane using FET-SEED smart pixels and free-space optics to interconnect printed circuit boards (PCBs) in a two board, unidirectional link configuration. Four X four arrays of FET-SEED transceivers were designed, fabricated, and packaged at the PCB level. The optical interconnection was constructed using diffractive micro-optics, and custom optomechanics. The system was operated in two modes, one showing high data throughput, 50 MBit/sec, and the other demonstrating large connection densities, 2222 channel/cm2.
The alert did not successfully save. Please try again later.
David V. Plant, B. R. Robertson, Harvard Scott Hinton, Guillaume C. Boisset, N. H. Kim, Yong Sheng Liu, M. R. Otazo, D. R. Rolston, Alain Z. Shang, William M. Robertson, "Microchannel-based optical backplane demonstrators using FET-SEED smart pixel arrays," Proc. SPIE 2400, Optoelectronic Interconnects III, (5 April 1995); https://doi.org/10.1117/12.206306