Paper
5 April 1995 New optical waveguide structure: a trench-channel-type high-density waveguide in Si
Tohru Nakamura, Takeshi Kato, Tomonori Tanoue, Fumio Murai, Mitsuo Takeda
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Abstract
A new optical waveguide suitable for high-packing-density OEICs is proposed. The waveguides are embedded in trenches, with large depth/width ratios, in a silicon substrate. The spacing between the waveguides and their pitch were less than 2 micrometers and 4 micrometers , respectively. This structure enables ultra high density optical interconnections in a silicon substrate.
© (1995) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Tohru Nakamura, Takeshi Kato, Tomonori Tanoue, Fumio Murai, and Mitsuo Takeda "New optical waveguide structure: a trench-channel-type high-density waveguide in Si", Proc. SPIE 2400, Optoelectronic Interconnects III, (5 April 1995); https://doi.org/10.1117/12.206298
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KEYWORDS
Waveguides

Silicon

Photonic integrated circuits

Optical interconnects

Channel waveguides

Capacitance

Integrated circuits

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