Algorithm design for use in cross-sectional x-ray image analysis of solder joints

Paul A. Roder

doi:10.1117/12.205525

27 March 1995 Algorithm design for use in cross-sectional x-ray image analysis of solder joints

Paul A. Roder

Proceedings Volume 2423, Machine Vision Applications in Industrial Inspection III; (1995) https://doi.org/10.1117/12.205525
Event: IS&T/SPIE's Symposium on Electronic Imaging: Science and Technology, 1995, San Jose, CA, United States

Abstract

This paper introduces algorithm design concepts that have proven useful in real-time X-ray solder joint inspection systems. Real-time industrial inspection systems face tremendous challenges, which are not always obvious when first designing such systems. The goal of this paper is to introduce a few of these challenges, as well as software and algorithm methodologies that effectively deal with some of these challenges. Specific examples included involve the real-time inspection of circuit board solder joints using cross-sectional X-ray images. Methods for dealing with solder joint orientations, utilities preserving subpixel and subgray level accuracy, and designs enabling code sharing are presented.

Citation Download Citation

Paul A. Roder "Algorithm design for use in cross-sectional x-ray image analysis of solder joints", Proc. SPIE 2423, Machine Vision Applications in Industrial Inspection III, (27 March 1995); https://doi.org/10.1117/12.205525

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