Algorithm design for use in cross-sectional x-ray image analysis of solder joints

Paul A. Roder

doi:10.1117/12.205525

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27 March 1995 Algorithm design for use in cross-sectional x-ray image analysis of solder joints

Paul A. Roder

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Proceedings Volume 2423, Machine Vision Applications in Industrial Inspection III; (1995) https://doi.org/10.1117/12.205525
Event: IS&T/SPIE's Symposium on Electronic Imaging: Science and Technology, 1995, San Jose, CA, United States

Abstract

This paper introduces algorithm design concepts that have proven useful in real-time X-ray solder joint inspection systems. Real-time industrial inspection systems face tremendous challenges, which are not always obvious when first designing such systems. The goal of this paper is to introduce a few of these challenges, as well as software and algorithm methodologies that effectively deal with some of these challenges. Specific examples included involve the real-time inspection of circuit board solder joints using cross-sectional X-ray images. Methods for dealing with solder joint orientations, utilities preserving subpixel and subgray level accuracy, and designs enabling code sharing are presented.

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Paul A. Roder "Algorithm design for use in cross-sectional x-ray image analysis of solder joints", Proc. SPIE 2423, Machine Vision Applications in Industrial Inspection III, (27 March 1995); https://doi.org/10.1117/12.205525

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