Shot-size reduction of photoresist formulations

Wayne M. Moreau; Kathleen M. Cornett; James T. Fahey; Leo L. Linehan; Warren Montgomery; Marina V. Plat; Randolph S. Smith; Robert L. Wood

doi:10.1117/12.210363

9 June 1995 Shot-size reduction of photoresist formulations

Wayne M. Moreau, Kathleen M. Cornett, James T. Fahey, Leo L. Linehan, Warren Montgomery, Marina V. Plat, Randolph S. Smith, Robert L. Wood

Author Affiliations +

Proceedings Volume 2438, Advances in Resist Technology and Processing XII; (1995) https://doi.org/10.1117/12.210363
Event: SPIE's 1995 Symposium on Microlithography, 1995, Santa Clara, CA, United States

Abstract

The cost of expendable chemicals in the resist process is increasing and with this the economic impetus to conserve usage. The volume of liquid resist dispensed (shot size) determines the consumption rate and disposal volumes of liquid resist. The choice of resist solvent can influence the shot volume. Three formulation factors influence the shot size: (1) the surface tension of the resist and the interfacial energy of the coating surface, (2) the viscosity of the resist formulation, and (3) the evaporation rate of the solvent. The suitable resist formulation and subsequent solvent choice should be of the lowest surface tension and lowest viscosity and be balanced by an evaporation rate which allows a minimum shot volume to be spread on the surface without significant solvent loss. Of all the solvents examined, ethyl 3-ethoxy propionate (EEP) gave the lowest shot size relative to the old resist solvent standard of 2- ethoxy ethyl acetate (ECA).

Citation Download Citation

Wayne M. Moreau, Kathleen M. Cornett, James T. Fahey, Leo L. Linehan, Warren Montgomery, Marina V. Plat, Randolph S. Smith, and Robert L. Wood "Shot-size reduction of photoresist formulations", Proc. SPIE 2438, Advances in Resist Technology and Processing XII, (9 June 1995); https://doi.org/10.1117/12.210363

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