Paper
7 July 1995 Thermal stressing techniques for flaw characterization with shearography
Jane W. Maclachlan Spicer, John L. Champion, Robert Osiander, James B. Spicer
Author Affiliations +
Abstract
Controlled heating of a test specimen with a laser source provides several advantages for flaw detection using shearographic detection. This stressing method is non-contacting, can be localized, and allows defect information to be obtained while heating. In addition, the beam profile can be tailored to aid in the detection of different defect types. This paper presents results of simultaneous observations of material response to an applied thermal load using both TRIR and shearographic detection methods. Of particular importance is the demonstration that the depth of a defect can be determined by measuring the time-dependence of the shearographic fringe development during heating.
© (1995) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jane W. Maclachlan Spicer, John L. Champion, Robert Osiander, and James B. Spicer "Thermal stressing techniques for flaw characterization with shearography", Proc. SPIE 2455, Nondestructive Evaluation of Aging Aircraft, Airports, Aerospace Hardware, and Materials, (7 July 1995); https://doi.org/10.1117/12.213539
Lens.org Logo
CITATIONS
Cited by 2 scholarly publications.
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Shearography

Thermography

Fringe analysis

Infrared radiation

Interfaces

Calibration

Defect detection

RELATED CONTENT

What's Out There State Of The Art Survey Of...
Proceedings of SPIE (March 21 1983)
Thermal targets for satellite calibration
Proceedings of SPIE (March 23 2001)
Nearby Object Radiometry
Proceedings of SPIE (December 23 1980)

Back to Top