Paper
3 July 1995 Application of phase-shift mask to GaAs IC fabrication process
Yoshiki Kojima, Mitsunori Nakatani, Hirofumi Nakano, Kazuya Kamon, Kazuhiko Sato
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Abstract
To obtain stable light contrast, a pattern accuracy, alignment accuracy and irradiation resistance of SOG have been investigated, and pattern layout has been optimized for the subresolution PSM and edge-line PSM. Satisfactory pattern accuracy and no deterioration in transmissivity index during exposure of 500,000 J/cm2 have been confirmed on fabricated PSMs. Applying these PSMs to GaAs IC process, a fine gate finger pattern of 0.3 micrometers has successfully been formed without generation of undesirable pattern in the joint area of gate finer and large area pad.
© (1995) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yoshiki Kojima, Mitsunori Nakatani, Hirofumi Nakano, Kazuya Kamon, and Kazuhiko Sato "Application of phase-shift mask to GaAs IC fabrication process", Proc. SPIE 2512, Photomask and X-Ray Mask Technology II, (3 July 1995); https://doi.org/10.1117/12.212786
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KEYWORDS
Gallium arsenide

Resistance

Photomasks

Monochromatic aberrations

Optical lithography

Phase shifts

Chromium

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