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15 June 1995 Application of hybrid detector technology for digital mammography
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A digital x-ray detector applying hybrid detector technology based on indium metal bump- bonding techniques was evaluated at x-ray energies of about 19.5 keV. Silicon of about 1 mm thickness forms the actual detector, converting x-rays directly into electrons (rather than generating light and converting light to photo-electrons). Time-delay-integration increases the sensitivity. Linearity, modulation transfer function, and noise power spectrum were evaluated. The results demonstrate that the system is useful as scanning x-ray detector for digital mammography and can meet and even exceed the performance of the conventional film/screen system.
© (1995) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Hans Roehrig, Tong Yu, Stephen D. Gaalema, S. R. Dev Sharma, John A. Minteer, and William E. Yorke "Application of hybrid detector technology for digital mammography", Proc. SPIE 2519, X-Ray and Ultraviolet Sensors and Applications, (15 June 1995);

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