Periodically corrugated microstrip wiring

Yon-Lin Kok

doi:10.1117/12.221238

22 September 1995 Periodically corrugated microstrip wiring

Yon-Lin Kok

Proceedings Volume 2532, Application and Theory of Periodic Structures; (1995) https://doi.org/10.1117/12.221238
Event: SPIE's 1995 International Symposium on Optical Science, Engineering, and Instrumentation, 1995, San Diego, CA, United States

Abstract

Propagation of subnanosecond pulses over Metal-Insulator-Semiconductor (MIS) microstrip line has been reported to suffer from serious time- delay (the Slow-wave effect) in the microwave/millimeter wave frequency range (200approximately equals 4000 MHz) and in the substrate resistivity range of 10^-3 approximately equals 10² (Omega) cm (such as in silicon or gallium arsenide). This is primarily due to a huge equivalent capacitance generated by the thin insulation layer. This paper investigates the feasibility of employing a periodically corrugated surface at the oxide- semiconductor interface, which provides guided mode conversion (TM-to- Hybrid mode), to decrease the equivalent inductance of the microstrip line and compensates for the increase in parasitic capacitance. The price paid for speed increase in signal propagation is signal attenuation. It is predicted that for wiring length less than 3 mm signal attenuation will be in a tolerable range (less than 10%).

Citation Download Citation

Yon-Lin Kok "Periodically corrugated microstrip wiring", Proc. SPIE 2532, Application and Theory of Periodic Structures, (22 September 1995); https://doi.org/10.1117/12.221238

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KEYWORDS

Signal attenuation

Radio propagation

Wave propagation

Inductance

Interfaces

Semiconductors

Silicon

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