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3 October 1995 High-speed 3D inspection system for solder bumps
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This paper discusses a high-speed 3-D inspection system for solder-bumps. The system uses a high-speed 3-D sensor system and an accurate measurement algorithm. Solder-bumps have recently been used for flip-chip bonding. Before bonding all bumps need their height and diameter inspected and if bumps are too big or too small, there is a danger of short or open circuits occurring after bonding on the substrate electrodes. Thus, a 100% inspection is required to assure high flip-chip bonding process yields. We developed a laser-based high- speed bump height capture system and an accurate bump height and diameter measurement algorithm. The inspection system takes 20 milliseconds to measure the height and diameter of a bump. It measures the bump height to an accuracy of plus or minus 3 micrometer, and the bump diameter to plus or minus 5 micrometer. Thus, this system is suitable for performing a 100% inspection of solder-bumps.
© (1995) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Hiroyuki Tsukahara, Youji Nishiyama, Fumiyuki Takahashi, Takashi Fuse, Moritoshi Ando, and Tohru Nishino "High-speed 3D inspection system for solder bumps", Proc. SPIE 2597, Machine Vision Applications, Architectures, and Systems Integration IV, (3 October 1995);


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