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19 January 1996 Optical system of an industrial 3D laser scanner for solder paste inspection
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Abstract
A new industrial 3D laser scanner is presented for measurement of solder paste screening quality in an automated PCB assembly line. Its unique scan optics provide telecentric illumination and imaging on a long scan line of 305 mm (12') at a maximum rate of more than 1000 scans per second. Synchronized height measurement is performed using a double triangulation scheme at large angles and wide aperture by means of a confocal like design based on elliptical mirrors. Using a spot size of 20 micrometers multiplied by 30 micrometers (FWHM), lateral resolution can be set electronically down to 10 micrometers pixel size. Depth resolution is 10 micrometers over a 2.5 mm measuring range. Combined with accurate and fast processing and control electronics this 3D sensor enables full 100% inspection at production speed.
© (1996) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jef L. Horijon, Willem D. van Amstel, Fred C. M. Couweleers, and Wilco C.A. Ligthart "Optical system of an industrial 3D laser scanner for solder paste inspection", Proc. SPIE 2599, Three-Dimensional and Unconventional Imaging for Industrial Inspection and Metrology, (19 January 1996); https://doi.org/10.1117/12.230375
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