Flip-chip optical fiber attachment to a monolithic optical receiver chip

Vijayanand Vusirikala; Peter J.S. Heim; Mario Dagenais; C. Philip McClay

doi:10.1117/12.228877

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27 December 1995 Flip-chip optical fiber attachment to a monolithic optical receiver chip

Vijayanand Vusirikala, Peter J.S. Heim, Mario Dagenais, C. Philip McClay

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Proceedings Volume 2613, Emerging Components and Technologies for All-Optical Networks; (1995) https://doi.org/10.1117/12.228877
Event: Photonics East '95, 1995, Philadelphia, PA, United States

Abstract

We report on manufacturable, low cost scheme for precision packaging a monolithically integrated GaAs optical receiver. Silicon V-groove and flip-chip bonding technologies are used to reliably achieve the required alignment accuracy. A silicon fiber carrier, which houses the fiber in a V-groove, is flip-chip bonded on to the receiver chip. The light from the cleaved end of the fiber is reflected off the V-groove end on to the planar photodetector, with an optical coupling efficiency of 85%. The entire fiber attach process uses standard semiconductor fabrication and processing techniques, making it attractive for low cost manufacturing.

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Vijayanand Vusirikala, Peter J.S. Heim, Mario Dagenais, and C. Philip McClay "Flip-chip optical fiber attachment to a monolithic optical receiver chip", Proc. SPIE 2613, Emerging Components and Technologies for All-Optical Networks, (27 December 1995); https://doi.org/10.1117/12.228877

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