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27 December 1995 Flip-chip optical fiber attachment to a monolithic optical receiver chip
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We report on manufacturable, low cost scheme for precision packaging a monolithically integrated GaAs optical receiver. Silicon V-groove and flip-chip bonding technologies are used to reliably achieve the required alignment accuracy. A silicon fiber carrier, which houses the fiber in a V-groove, is flip-chip bonded on to the receiver chip. The light from the cleaved end of the fiber is reflected off the V-groove end on to the planar photodetector, with an optical coupling efficiency of 85%. The entire fiber attach process uses standard semiconductor fabrication and processing techniques, making it attractive for low cost manufacturing.
© (1995) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Vijayanand Vusirikala, Peter J.S. Heim, Mario Dagenais, and C. Philip McClay "Flip-chip optical fiber attachment to a monolithic optical receiver chip", Proc. SPIE 2613, Emerging Components and Technologies for All-Optical Networks, (27 December 1995);

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