Paper
8 December 1995 Integration of an advanced laser writer into a manufacturing environment
Author Affiliations +
Abstract
The integration of an advanced high resolution laser lithography system for sub-0.50 micron technology, utilizing a 32 beam, 8 pass exposure writing strategy, in a merchant production mask-making environment, is explored. The ALTA-3000 tool represents the latest evolution of mask lithography platforms and, as such, has several advantages over the traditional e-beam or CORE exposure systems. For example, on a laser tool there is no requirement for a high vacuum system, and the complexities associated therein. Unexposed masks are not carried in individual cassettes, as in an e-beam system, and therefore system performance is not subjected to these error sources. Freedom from the potentially adverse affects of these sub- systems should appear as improvements on product performance in the areas of registration and defect control. The additional gray scales of the 32 beam architecture enable increased averaging of the individual beams, thus leading to improvements in print performance, relative to earlier versions of laser technology. The production capability of the ALTA-3000 is analyzed to determine what type of routine performance can be expected in terms of resolution, linewidth control, linearity, registration, defect control, and printing speed. The primary goal of this evaluation is to determine if the performance of the system is capable of meeting reticle requirements for 64 and 256 megabit chips and 5th and 6th generation microprocessors, which are expected to require 0.35 and 0.25 micron geometries on the wafer. The evaluation revealed the basic capability exists, however, additional work must be done in the area of registration control to improve the yields necessary to support high volume production for these technologies.
© (1995) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Gregg Inderhees and Robert M. Kiefer "Integration of an advanced laser writer into a manufacturing environment", Proc. SPIE 2621, 15th Annual BACUS Symposium on Photomask Technology and Management, (8 December 1995); https://doi.org/10.1117/12.228207
Lens.org Logo
CITATIONS
Cited by 2 scholarly publications.
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Photomasks

Reticles

Etching

Optical alignment

Lithography

Manufacturing

Critical dimension metrology

RELATED CONTENT

Application of dry etching to 1-Gb DRAM mask fabrication
Proceedings of SPIE (September 01 1998)
Extension of graybeam writing for the 130-nm technology node
Proceedings of SPIE (December 30 1999)
Phase-shift mask applications
Proceedings of SPIE (July 01 1991)
Use of a MEBES tool to manufacture 180-nm reticles
Proceedings of SPIE (April 28 1999)
Line width verification for 0.18 and 0.25 um design...
Proceedings of SPIE (August 25 1999)

Back to Top