Reduction of post develop residue using optimal developer chemistry and develop/rinse processes

George P. Mirth

doi:10.1117/12.221453

22 September 1995 Reduction of post develop residue using optimal developer chemistry and develop/rinse processes

George P. Mirth

Proceedings Volume 2635, Microelectronic Manufacturing Yield, Reliability, and Failure Analysis; (1995) https://doi.org/10.1117/12.221453
Event: Microelectronic Manufacturing '95, 1995, Austin, TX, United States

Abstract

This paper summarized a collection of work and experimentation on detecting, classifying and reducing post developer defects. Various experiments demonstrate the effects of substrate priming, pH shock at rinse, resist hydrophobicity, rinse methods and developer surfactants in reducing post develop defects.

Citation Download Citation

George P. Mirth "Reduction of post develop residue using optimal developer chemistry and develop/rinse processes", Proc. SPIE 2635, Microelectronic Manufacturing Yield, Reliability, and Failure Analysis, (22 September 1995); https://doi.org/10.1117/12.221453

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