Paper
19 September 1995 Electroplated nickel mold insert for LIGA
Vikas Galhotra, Venkat Sangishetty, Evan Ma, Kevin W. Kelly
Author Affiliations +
Proceedings Volume 2639, Micromachining and Microfabrication Process Technology; (1995) https://doi.org/10.1117/12.221273
Event: Micromachining and Microfabrication, 1995, Austin, TX, United States
Abstract
The LIGA process is being developed at Louisiana State University (LSU) to mass produce high aspect ratio microstructures. One component of the LIGA process is the manufacture of mold inserts. The progress associated with manufacturing an electroplated nickel mold insert is described in this paper. Unique features of our nickel electrodeposition procedures are discussed.
© (1995) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Vikas Galhotra, Venkat Sangishetty, Evan Ma, and Kevin W. Kelly "Electroplated nickel mold insert for LIGA", Proc. SPIE 2639, Micromachining and Microfabrication Process Technology, (19 September 1995); https://doi.org/10.1117/12.221273
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CITATIONS
Cited by 8 scholarly publications.
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KEYWORDS
Nickel

Polymethylmethacrylate

Manufacturing

Electroplating

Photoresist processing

Semiconducting wafers

Photomasks

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