Paper
19 September 1995 Microstructuring by excimer laser
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Proceedings Volume 2639, Micromachining and Microfabrication Process Technology; (1995) https://doi.org/10.1117/12.221283
Event: Micromachining and Microfabrication, 1995, Austin, TX, United States
Abstract
Excimer laser ablation provides the micromachining engineer with a unique tool for patterning, cutting, and structuring a wide variety of materials, including ceramics, glasses, and polymers. The short pulse (20 ns) ultra violet laser beam is used for nonthermal ablative material removal producing structures with a depth resolution of the order of 0.1 micrometers and spatial resolutions of the order of 1 micrometers or better. Careful control of laser dose (usually done using CNC systems) enables multi-level machining to be performed producing 3D microstructures which may be used directly, or as mold tools for laser-LIGA replication. This talk aims to illustrate both the possibilities, and limitations, of micormachining by excimer laser ablation, and will highlight some practical examples of structures and devices manufactured using this tool, many of which are currently in or near commercial production.
© (1995) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Erol C. Harvey, Phil T. Rumsby, Malcolm C. Gower, and Jason L. Remnant "Microstructuring by excimer laser", Proc. SPIE 2639, Micromachining and Microfabrication Process Technology, (19 September 1995); https://doi.org/10.1117/12.221283
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Cited by 47 scholarly publications.
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KEYWORDS
Excimer lasers

Laser ablation

Polymers

Micromachining

Objectives

Control systems

Pulsed laser operation

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