Modeling VCSEL characteristics using device and package models

Nina D. Morozova; Yung-Cheng Lee

doi:10.1117/12.236920

29 March 1996 Modeling VCSEL characteristics using device and package models

Nina D. Morozova, Yung-Cheng Lee

Proceedings Volume 2691, Optoelectronic Packaging; (1996) https://doi.org/10.1117/12.236920
Event: Photonics West '96, 1996, San Jose, CA, United States

Abstract

An integrated tool has been developed to predict how vertical cavity surface emitting laser (VCSEL) light output power is affected by packaging components. The set that has been developed includes modeling tools for devices and packages. The integrated tool can be useful for choosing an optimum specific package design for a VCSEL structure and to predict its characteristics in different packages under a variety of operating conditions. In this paper the integrated tool has been applied to study how VCSEL light output power is affected by different assembly technologies and packaging materials.

Citation Download Citation

Nina D. Morozova and Yung-Cheng Lee "Modeling VCSEL characteristics using device and package models", Proc. SPIE 2691, Optoelectronic Packaging, (29 March 1996); https://doi.org/10.1117/12.236920

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