rf optoelectronic transmitter and receiver arrays on silicon wafer boards

Daniel Yap; Willie W. Ng; Deborah M. Bohmeyer; Hui Pin Hsu; Huan-Wun Yen; Marvin J. Tabasky; Andrew J. Negri; Joseph Mehr; Craig A. Armiento; Paul O. Haugsjaa

doi:10.1117/12.236912

29 March 1996 rf optoelectronic transmitter and receiver arrays on silicon wafer boards

Daniel Yap, Willie W. Ng, Deborah M. Bohmeyer, Hui Pin Hsu, Huan-Wun Yen, Marvin J. Tabasky, Andrew J. Negri, Joseph Mehr, Craig A. Armiento, Paul O. Haugsjaa

Author Affiliations +

Proceedings Volume 2691, Optoelectronic Packaging; (1996) https://doi.org/10.1117/12.236912
Event: Photonics West '96, 1996, San Jose, CA, United States

Abstract

Silicon waferboard technology based on etched and deposited passive-alignment features has been applied to the fabrication of optoelectronic transmitter and receiver arrays for rf applications. Using silicon waferboards, we have aligned both 1 by 4 buried-heterostructure laser arrays and 1 by 4 PIN photodetector arrays to optical fiber ribbons. Besides serving as mechanical carriers and alignment guides, the silicon wafers can also be used as rf or microwave substrates. We introduce rf-optoelectronic receiver arrays based on such enhanced silicon waferboards.

Citation Download Citation

Daniel Yap, Willie W. Ng, Deborah M. Bohmeyer, Hui Pin Hsu, Huan-Wun Yen, Marvin J. Tabasky, Andrew J. Negri, Joseph Mehr, Craig A. Armiento, and Paul O. Haugsjaa "rf optoelectronic transmitter and receiver arrays on silicon wafer boards", Proc. SPIE 2691, Optoelectronic Packaging, (29 March 1996); https://doi.org/10.1117/12.236912

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