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8 April 1996 High-speed micromachining with UV-copper vapor lasers
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Abstract
Ablation rate characteristics (etch rates) are presented for micro-machining of polyimide (kapton) and PETG using a frequency doubled Copper Vapor Laser (uv-CVL) at 255 nm and a frequency quadrupled Nd:YLF (4*Nd:YLF) laser at 261 nm. A comparison is made of the etch rates obtained by continuous ablation at 4.25 kHz with the uv-CVL with rates obtained for bursts of pulses with 2 second intervals between bursts. These results suggest that the observed decrease in ablation depth per pulse after a number of pulses for fluences above 0.6 J/cm2 is due to attenuation of succeeding laser pulses by the plume of previously-ejected material. Preliminary results of the effect of sample temperature on ablation rates are also presented.
© (1996) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Elizabeth K. Illy, Alison C. J. Glover, Michael J. Withford, and James A. Piper "High-speed micromachining with UV-copper vapor lasers", Proc. SPIE 2703, Lasers as Tools for Manufacturing of Durable Goods and Microelectronics, (8 April 1996); https://doi.org/10.1117/12.237754
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