Paper
8 April 1996 Laser planarization of chemical vapor deposited diamond film
Ronald D. Schaeffer, Li Chen, Wen Ho
Author Affiliations +
Abstract
Diamond films are grown by depositing carbon from gaseous species on prepared substrates. This process does not give surface uniformity, especially on the growth side where crystalline formations create very rough surfaces. In addition, there is usually an associated bow of the disc caused by strains in the material after removal from substrate. Since diamond is the hardest material, traditional grinding techniques, while fairly low cost, take an extremely long time. An extension of using lasers for cutting the material into usable shapes is to use lasers for the initial `flattening' procedure. This method has a significantly higher cost per hour, but usually requires much less time for equivalent volume removal. The use of lasers to remove bulk surface volume from CVDD and a few other materials will be discussed. Also, an extension of the fundamental concepts to automated manufacturing will be given.
© (1996) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ronald D. Schaeffer, Li Chen, and Wen Ho "Laser planarization of chemical vapor deposited diamond film", Proc. SPIE 2703, Lasers as Tools for Manufacturing of Durable Goods and Microelectronics, (8 April 1996); https://doi.org/10.1117/12.237736
Lens.org Logo
CITATIONS
Cited by 1 scholarly publication.
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Diamond

Etching

Laser cutting

Chemical vapor deposition

Laser processing

Excimer lasers

Semiconducting wafers

Back to Top