Geometry of x-ray point source proximity printing, part II: overlay effects

Peter A. Hollanda

doi:10.1117/12.240485

27 May 1996 Geometry of x-ray point source proximity printing, part II: overlay effects

Peter A. Hollanda

Proceedings Volume 2723, Electron-Beam, X-Ray, EUV, and Ion-Beam Submicrometer Lithographies for Manufacturing VI; (1996) https://doi.org/10.1117/12.240485
Event: SPIE's 1996 International Symposium on Microlithography, 1996, Santa Clara, CA, United States

Abstract

When residual or uncorrected leveling/tilt errors are present at a wafer site, during exposure, gap accuracy and repeatability can not be determined from overall field size measurements in the x and y directions. In such cases, gap is a function of wafer/site plane leveling or tilt in the exposure column. For a given field size, gap is determined by the tilt angle, or conversely, for a given site tilt angle, gap, is a function of field size. As a result, four measurements are needed, at each site, to determine both the actual site position and orientation during exposure, and the corrections required to reduce the magnification errors and field distortions to acceptable levels.

Citation Download Citation

Peter A. Hollanda "Geometry of x-ray point source proximity printing, part II: overlay effects", Proc. SPIE 2723, Electron-Beam, X-Ray, EUV, and Ion-Beam Submicrometer Lithographies for Manufacturing VI, (27 May 1996); https://doi.org/10.1117/12.240485

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