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23 August 1996 Large-scale high-resolution 3D laser scanner for solder-paste inspection
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An industrial 3D laser scanner is presented for measurement of solder paste screening quality in an automated PCB assembly line. The scanner provides telecentric illumination and imaging in a 305 mm (12') long scan line at a maximum rate of more than 1000 scans per second. Synchronized height measurement is performed using a double triangulation scheme at large angles and wide aperture. Pixel sizes range down to 18 micrometers , yielding more than 16,000 pixels in a scan line. Depth resolution is 10 micrometers over a 2.5 mm measuring range. Some practical details on scanner assembly will be discussed. Combined with accurate, fast processing and control electronics this 3D sensor enables 100% inspection at high production speeds.
© (1996) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jef L. Horijon, Fred C. M. Couweleers, and Willem D. van Amstel "Large-scale high-resolution 3D laser scanner for solder-paste inspection", Proc. SPIE 2774, Design and Engineering of Optical Systems, (23 August 1996);


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