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29 December 1981 Large Time-Delay-And-Integration (TDI) Arrays And Focal Plane Structures With Intrinsic Silicon Response
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Proceedings Volume 0282, Technical Issues in Focal Plane Development; (1981)
Event: 1981 Technical Symposium East, 1981, Washington, D.C., United States
This paper is primarily a review of two recent focal plane development projects. The first focal plane consists of six 1024x64 element TDI image sensor chips mounted on a prism beam-sharer. This focal plane is designed to give a video signal with high SNR over a wide dynamic range. The second focal plane consists of a single 1024x128 element TDI image sensor chip. It is designed to perform over a wide dynamic range extending down to starlight scene illumination levels. Both chip designs employ buried channel, silicon gate CCD technology. The silicon gate sensing area is designed for maximum broadband quantum efficiency over the range 500-900nm; an average quantum efficiency over that range of 50 percent has been achieved. The sensor element in both chip designs is a 20x20 micrometer square stage of a four-phase CCD register. This element design provides high MTF and a saturation charge level of approximately 1x106 electrons/pixel as is needed for achieving high SNR. On-chip preamplifiers are designed for specific requirements of the focal planes. The chip for the first focal plane utilizes a highly linear resettable floating gate amplifier; the linearity facilitates matching of imagery generated by neighboring chips. The chip for the second focal plane has two preamplifiers which may be read out in parallel; the first handles the full dynamic range of the CCD output and the second, because of higher gain, handles only the low end of the CCD output. The high gain amplifier has operated at 1MHz sample rate with a noise equivalent signal level of approximately 20 electrons/pixel RMS.
© (1981) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
R. H. Dyck and H. Sadowski "Large Time-Delay-And-Integration (TDI) Arrays And Focal Plane Structures With Intrinsic Silicon Response", Proc. SPIE 0282, Technical Issues in Focal Plane Development, (29 December 1981);


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