Multiexposure capability development for deep x-ray lithography for MEMS

Chantal G. Khan Malek; Robert L. Wood; Bruce W. Dudley; Zhong Geng Ling; Volker Saile

doi:10.1117/12.250947

Translator Disclaimer

13 September 1996 Multiexposure capability development for deep x-ray lithography for MEMS

Chantal G. Khan Malek, Robert L. Wood, Bruce W. Dudley, Zhong Geng Ling, Volker Saile

Author Affiliations +

Proceedings Volume 2880, Microlithography and Metrology in Micromachining II; (1996) https://doi.org/10.1117/12.250947
Event: Micromachining and Microfabrication '96, 1996, Austin, TX, United States

Abstract

The X-ray lithography and micromachining facility at CAMD hosts the `print-shop' for the development and prototype exposures in LIGA-like processing techniques for the HI-MEMS Alliance. A simple fixture with alignment, tilt, and rotation modules has been developed. It allows for multiple level exposures with registration. More complex shapes can be achieved by rotating and tilting the mask/wafer assembly with respect to the incident X-ray beam. The alignment system is based on optical registration using an X-ray mask with targets on optically transparent windows. The masks were fabricated at MCNC. The alignment tests and off-axis exposures were performed at CAMD. Overlay accuracy of +/- 5 micrometers has been demonstrated.

Citation Download Citation

Chantal G. Khan Malek, Robert L. Wood, Bruce W. Dudley, Zhong Geng Ling, and Volker Saile "Multiexposure capability development for deep x-ray lithography for MEMS", Proc. SPIE 2880, Microlithography and Metrology in Micromachining II, (13 September 1996); https://doi.org/10.1117/12.250947

ACCESS THE FULL ARTICLE