Bonding techniques for single crystal TFT AMLCDs

Sonja van der Groen; Maarten Rosmeulen; Philippe Jansen; Ludo Deferm; Christiaan Baert

doi:10.1117/12.251250

23 September 1996 Bonding techniques for single crystal TFT AMLCDs

Sonja van der Groen, Maarten Rosmeulen, Philippe Jansen, Ludo Deferm, Christiaan Baert

Proceedings Volume 2881, Microelectronic Structures and MEMS for Optical Processing II; (1996) https://doi.org/10.1117/12.251250
Event: Micromachining and Microfabrication '96, 1996, Austin, TX, United States

Abstract

Transmissive single crystal AMLCD light valves have recently drawn much attention for application in flat panel displays. The active matrix circuits are fabricated on SIMOX wafers and then transferred to glass. Circuit transfer consists in bonding a CMOS processed SIMOX wafer to a Pyrex glass substrate, thinning the SIMOX wafer and opening the contact pads. The pixel electrodes are made in polysilicon to allow standard CMOS processing. This paper discusses the transparency of the poly electrode and evaluates the potential of anodic bonding and adhesive bonding for circuit transfer. A major challenge for anodic bonding is the protection of the device dielectrics against the high voltages applied during bonding. A test chip was designed to investigate different ways of circumventing breakdown of the dielectrics. A method for adhesive bonding is discussed that assures good uniformity of the thickness of the epoxy layer and avoids the inclusion of air bubbles. It is demonstrated that the epoxies are resistant to the chemicals used for thinning the silicon substrate.

Citation Download Citation

Sonja van der Groen, Maarten Rosmeulen, Philippe Jansen, Ludo Deferm, and Christiaan Baert "Bonding techniques for single crystal TFT AMLCDs", Proc. SPIE 2881, Microelectronic Structures and MEMS for Optical Processing II, (23 September 1996); https://doi.org/10.1117/12.251250

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