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23 September 1996 Tradeoffs in MEMS materials
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Proceedings Volume 2881, Microelectronic Structures and MEMS for Optical Processing II; (1996)
Event: Micromachining and Microfabrication '96, 1996, Austin, TX, United States
To control the third dimension of micro mechanical structures, new materials have to be designed. Unfortunately, increased manufacturability results generally in degraded mechanical and electrical characteristics. The paper is presenting a detailed analysis of p+ silicon as a mechanical material for microresonators and of the low temperature dielectrics used in electrostatic microactuators. All the relevant parameters of p+ silicon are experimentally determined and process recommendations allowing improved quality are formulated. Charge injection and trapping in low temperature dielectrics are analyzed and their impact on the behavior of the electrostatic actuators evaluated.
© (1996) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Cleopatra Cabuz "Tradeoffs in MEMS materials", Proc. SPIE 2881, Microelectronic Structures and MEMS for Optical Processing II, (23 September 1996);

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