Low-cost mask for excimer laser projection ablation

James L. Speidell; Rajesh S. Patel; Steven A. Cordes

doi:10.1117/12.262824

27 December 1996 Low-cost mask for excimer laser projection ablation

James L. Speidell, Rajesh S. Patel, Steven A. Cordes

Proceedings Volume 2884, 16th Annual BACUS Symposium on Photomask Technology and Management; (1996) https://doi.org/10.1117/12.262824
Event: 16th Annual BACUS Symposium on Photomask Technology and Management, 1996, Redwood City, CA, United States

Abstract

Excimer laser projection ablation is a dry patterning process in which an intense beam of ultraviolet light from an excimer laser is used to directly pattern a material. This technique has been used extensively in the microelectronics industry for patterning both organic and inorganic materials. Excimer laser projection ablation requires the use of a mask which is similar to a conventional 1X photomask. The laser ablation mask must withstand significantly higher energy densities than conventional photolithographic masks. A dielectric mask structure which consists of a quartz substrate coated with a stack of dielectric thin films has been developed for this process. Although the dielectric mask has been used successfully in a manufacturing environment, it suffers from the disadvantages of a complex fabrication process and high cost. Alternatives to the dielectric mask have been explored and a new mask has been developed which consists of an aluminum film on a quartz substrate. This mask meets the requirements for the laser ablation process and has the advantage of a low cost fabrication process which is similar to conventional chrome on quartz photomasks. The mask development, specifications, fabrication and results are discussed.

Citation Download Citation

James L. Speidell, Rajesh S. Patel, and Steven A. Cordes "Low-cost mask for excimer laser projection ablation", Proc. SPIE 2884, 16th Annual BACUS Symposium on Photomask Technology and Management, (27 December 1996); https://doi.org/10.1117/12.262824

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