Paper
3 October 1996 High-speed autoverifying technology for printed wiring boards
Moritoshi Ando, Hiroshi Oka, Hideo Okada, Yorihiro Sakashita, Nobumi Shibutani
Author Affiliations +
Abstract
We have developed an automated pattern verification technique. The output of an automated optical inspection system contains many false alarms. Verification is needed to distinguish between minor irregularities and serious defects. In the past, this verification was usually done manually, which led to unsatisfactory product quality. The goal of our new automated verification system is to detect pattern features on surface mount technology boards. In our system, we employ a new illumination method, which uses multiple colors and multiple direction illumination. Images are captured with a CCD camera. We have developed a new algorithm that uses CAD data for both pattern matching and pattern structure determination. This helps to search for patterns around a defect and to examine defect definition rules. These are processed with a high speed workstation and a hard-wired circuits. The system can verify a defect within 1.5 seconds. The verification system was tested in a factory. It verified 1,500 defective samples and detected all significant defects with only a 0.1 percent of error rate (false alarm).
© (1996) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Moritoshi Ando, Hiroshi Oka, Hideo Okada, Yorihiro Sakashita, and Nobumi Shibutani "High-speed autoverifying technology for printed wiring boards", Proc. SPIE 2899, Automated Optical Inspection for Industry, (3 October 1996); https://doi.org/10.1117/12.252996
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KEYWORDS
Copper

Algorithm development

Defect detection

Computer aided design

Inspection

Sensors

CCD cameras

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