Paper
20 March 1997 Behaviors of single-lap adhesive joints subjected to static and impact loads
Toshiyuki Sawa, Hidekazu Suga
Author Affiliations +
Proceedings Volume 2921, International Conference on Experimental Mechanics: Advances and Applications; (1997) https://doi.org/10.1117/12.269842
Event: International Conference on Experimental Mechanics: Advances and Applications, 1996, Singapore, Singapore
Abstract
In this study, the stress distributions in single lap joints subjected to static load were measured by photoelasticity, and the effects of Young's modulus ratio of dissimilar adherends and the adherend thickness on joint strength were examined. In addition, the strains were measured when a joint was subjected to an impact load. It is seen that singular stresses occur at the edges of the interfaces. It is also seen that the joint strength increases as Young's modulus of the adherends and the adherend thickness increase. FEM analyses are carried out when joints are subjected to impact loads. The measured results are compared with the numerical results. Discussions are made on the behavior of single-lap adhesive joints.
© (1997) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Toshiyuki Sawa and Hidekazu Suga "Behaviors of single-lap adhesive joints subjected to static and impact loads", Proc. SPIE 2921, International Conference on Experimental Mechanics: Advances and Applications, (20 March 1997); https://doi.org/10.1117/12.269842
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Cited by 3 scholarly publications.
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KEYWORDS
Adhesives

Photoelasticity

Finite element methods

Epoxies

Copper

Interfaces

Stress analysis

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