Paper
20 March 1997 Mechanical behavior of bolted wood joint using electronic speckle pattern interferometry
Chi-Jen Chen, Pramod Kumar Rastogi
Author Affiliations +
Proceedings Volume 2921, International Conference on Experimental Mechanics: Advances and Applications; (1997) https://doi.org/10.1117/12.269879
Event: International Conference on Experimental Mechanics: Advances and Applications, 1996, Singapore, Singapore
Abstract
Electronic speckle pattern interferometry is used to examine the bearing capacity of a bolted joint with increasing load levels. The bolt is embedded in the wood and is loaded in compression. The observation of the in-plane deformations on wood specimens is obtained in real-time.
© (1997) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Chi-Jen Chen and Pramod Kumar Rastogi "Mechanical behavior of bolted wood joint using electronic speckle pattern interferometry", Proc. SPIE 2921, International Conference on Experimental Mechanics: Advances and Applications, (20 March 1997); https://doi.org/10.1117/12.269879
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KEYWORDS
Interferometry

Speckle pattern

Failure analysis

Civil engineering

Fringe analysis

Connectors

Electronic components

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