Rapid laser prototyping of multichip modules

Jason D. Reed; Ian Yee; Brent Lunceford; Minchuan Wang; Guy Caldwell; Anjan Somadder; Tom J. Hirsch; Deborah Cobb; Robert F. Miracky

doi:10.1117/12.270016

27 March 1997 Rapid laser prototyping of multichip modules

Jason D. Reed, Ian Yee, Brent Lunceford, Minchuan Wang, Guy Caldwell, Anjan Somadder, Tom J. Hirsch, Deborah Cobb, Robert F. Miracky

Author Affiliations +

Proceedings Volume 2993, Lasers as Tools for Manufacturing II; (1997) https://doi.org/10.1117/12.270016
Event: Photonics West '97, 1997, San Jose, CA, United States

Abstract

MCC has developed a rapid prototyping technology for manufacturing high density interconnections for multichip modules (MCMs). By using laser direct writing to customize a high density pre-manufactured programmable substrate, the time required to make an MCM is reduced from several months to weeks. No photomasks are required, so the non-recurring engineering costs that are typical of full custom designs are significantly reduced or eliminated. The substrates are manufactured by commercial manufacturers using their standard fabrication processes, so the technology offers high performance, reliability, and robustness. The substrates are laser customized with subtractive and additive metallization processes. The subtractive processes are used to divide wiring segments. The additive processes are used to link the segments into the design-specific nets. A rerouting process is used to enable flip chip connections to area array and perimeter pad ICs so that prototype flip chip MCM work can be done immediately with pre-existing IC perimeter pad layouts. The rerouting process uses photoablation of vias in polyimide and laser lithography to define an interconnect metal between substrate wiring and the flip chip landpads. The laser prototyping process was used to make a signal integrity multichip module that has 1296 flip chip connections and 192 I/Os and designed to operate at over 400 Mb/s between ICs.

Citation Download Citation

Jason D. Reed, Ian Yee, Brent Lunceford, Minchuan Wang, Guy Caldwell, Anjan Somadder, Tom J. Hirsch, Deborah Cobb, and Robert F. Miracky "Rapid laser prototyping of multichip modules", Proc. SPIE 2993, Lasers as Tools for Manufacturing II, (27 March 1997); https://doi.org/10.1117/12.270016

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