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4 April 1997 Low-power multichip module and board-level links for data transfer
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Advanced device technologies such as vertical cavity surface emitting lasers (VCSELs) and diffractive micro lenses can be combined with novel packaging techniques to allow low-power interconnection of parallel optical signals. These interconnections can be realized directly on circuit boards, in a multi-chip module format, or in packages that emulate electrical connectors. For applications such as stacking of multi-chip module (MCM) layers, the links may be realized in bi-directional form using integrated diffractive microlenses. In the stacked MCM design, consumed electrical power is minimized by use of a relatively high laser output from high efficiency VCSELs, and a receiver design that is optimized for low power, at the expense of dynamic range. WIthin certain constraints, the design may be extended to other forms such as board-level interconnects.
© (1997) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Richard Franklin Carson, Terry L. Hardin, Mial E. Warren, Kevin L. Lear, Michael L. Lovejoy, Pamela K. Seigal, David C. Craft, and Paul J. Enquist "Low-power multichip module and board-level links for data transfer", Proc. SPIE 3005, Optoelectronic Interconnects and Packaging IV, (4 April 1997);

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