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15 April 1997Wafer level thin-film solder bonding of a hybrid sensor for interfacial force microscopy
We discuss the design, fabrication and performance of a hybrid force sensor for Interfacial Force Microscopy which features a new wafer-level, thin-film soldering technique.
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Carolyn M. Matzke, Jack E. Houston, "Wafer level thin-film solder bonding of a hybrid sensor for interfacial force microscopy," Proc. SPIE 3009, Micromachining and Imaging, (15 April 1997); https://doi.org/10.1117/12.271225