Experimental study for thermal postbuckling of isotropic and composite panels with embedded shape memory alloy

Ming-Tsang Ho; Roger R. Chen; Li-Chun Chu

doi:10.1117/12.275716

6 June 1997 Experimental study for thermal postbuckling of isotropic and composite panels with embedded shape memory alloy

Ming-Tsang Ho, Roger R. Chen, Li-Chun Chu

Author Affiliations +

Proceedings Volume 3041, Smart Structures and Materials 1997: Smart Structures and Integrated Systems; (1997) https://doi.org/10.1117/12.275716
Event: Smart Structures and Materials '97, 1997, San Diego, CA, United States

Abstract

Thermal post-buckling behaviors of various passive panels were tested and analyzed. A test fixture was developed for easy installation of the test panels and control of the test conditions. The isotropic test panels were made of aluminum while the composite test panels were of graphite/epoxy type. Both panels with and without embedded shape memory alloy (SMA) strips as the reinforcing elements were tested, compared, and documented. The experimental data were compared with the analysis derived from a finite-element model. It is shown that the passive panels with embedded SMA strips do deform much less than the ones without SMA when temperature rises above the critical buckling point. The post-buckling behaviors of the isotropic panels conform to the analysis given some assumptions about the temperature dependent recovery stress. The composite panels, however, present some complicated thermal buckling modes which are not modeled at this present study. Further research into those complicated mode shapes of the SMA embedded composite panels is suggested.

Citation Download Citation

Ming-Tsang Ho, Roger R. Chen, and Li-Chun Chu "Experimental study for thermal postbuckling of isotropic and composite panels with embedded shape memory alloy", Proc. SPIE 3041, Smart Structures and Materials 1997: Smart Structures and Integrated Systems, (6 June 1997); https://doi.org/10.1117/12.275716

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