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6 June 1997 Experimental study for thermal postbuckling of isotropic and composite panels with embedded shape memory alloy
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Abstract
Thermal post-buckling behaviors of various passive panels were tested and analyzed. A test fixture was developed for easy installation of the test panels and control of the test conditions. The isotropic test panels were made of aluminum while the composite test panels were of graphite/epoxy type. Both panels with and without embedded shape memory alloy (SMA) strips as the reinforcing elements were tested, compared, and documented. The experimental data were compared with the analysis derived from a finite-element model. It is shown that the passive panels with embedded SMA strips do deform much less than the ones without SMA when temperature rises above the critical buckling point. The post-buckling behaviors of the isotropic panels conform to the analysis given some assumptions about the temperature dependent recovery stress. The composite panels, however, present some complicated thermal buckling modes which are not modeled at this present study. Further research into those complicated mode shapes of the SMA embedded composite panels is suggested.
© (1997) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ming-Tsang Ho, Roger R. Chen, and Li-Chun Chu "Experimental study for thermal postbuckling of isotropic and composite panels with embedded shape memory alloy", Proc. SPIE 3041, Smart Structures and Materials 1997: Smart Structures and Integrated Systems, (6 June 1997); https://doi.org/10.1117/12.275716
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