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7 July 1997 Sloped irradiation techniques in deep x-ray lithography for 3D shaping of microstructures
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Deep x-ray lithography (DXRL) makes use of synchrotron radiation (SR) to transfer an absorber pattern from a mask into a thick resist layer. For most applications the direction of the SR beam is perpendicular to the mask and the resist plane. Subsequent replication techniques, e.g. electroforming, moulding or hot embossing, convert the resist relief obtained after development into micromechanical, microfluidic or micro- optical elements made from metals, polymers or ceramic materials. This process sequence is well known as the LIGA technique. The normal shadow printing process is complemented and enhanced by advanced techniques, e.g. by tilting the mask and the resist with respect to the SR beam or aligned multiple exposures to produce step-like structures. In this paper a technology for the fabrication of multidirectional inclined microstructures applying multiple tilted DXRL will be presented. Instead of one exposure with the mask/substrate assembly perpendicular to the SR beam, irradiation is performed several times applying tilt and rotational angles of the mask/substrate assembly relative to the SR beam. A huge variety of 3-D structures can be obtained using this technique. Some possible applications will be discussed.
© (1997) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Gregor Feiertag, Wolfgang Ehrfeld, Heinz Lehr, and Martin Schmidt "Sloped irradiation techniques in deep x-ray lithography for 3D shaping of microstructures", Proc. SPIE 3048, Emerging Lithographic Technologies, (7 July 1997);


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