Paper
7 July 1997 Time-dependent simulation of acid and product distributions in chemically amplified resist
Kazuya Kamon, Keisuke Nakazawa, Atsuko Yamaguchi, Nobuyuki N. Matsuzawa, Takeshi Ohfuji, Seiichi Tagawa
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Abstract
In KrF or ArF resist processing, a chemically amplified resist is widely used for ULSI device fabrication. Due to the catalytic reaction of generated acid, decomposition of a positive resist or cross linking of a negative resist is amplified during post-exposure baking. In order to take into account these characteristics during resist simulation, a resist simulator based upon the percolation theory is developed, and the acid and product distributions during post exposure baking are iteratively calculated. Thus, we can conclude that the acid and product distribution in resist film are time dependent. Moreover it is necessary to develop using percolation theory a resist simulator that can take into account macroscopic feature changes from microscopic molecular structural change. The dissolution rate curve and distribution of acid diffusion length are derived with percolation theory. Then the distribution of the product that corresponds to decomposition in a positive resist is calculated. When we increase the acid thermal diffusion enough to reduce the standing wave effect while keeping it small enough not to reach neighboring patterns, the contour lines of product distribution from the thermal catalyst reaction move vertically rather than horizontally. (This is not a molecule movement.) By using these features, the resist rectangularity is improved and the DOF is chemically enlarged.
© (1997) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Kazuya Kamon, Keisuke Nakazawa, Atsuko Yamaguchi, Nobuyuki N. Matsuzawa, Takeshi Ohfuji, and Seiichi Tagawa "Time-dependent simulation of acid and product distributions in chemically amplified resist", Proc. SPIE 3049, Advances in Resist Technology and Processing XIV, (7 July 1997); https://doi.org/10.1117/12.275817
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KEYWORDS
Diffusion

Chemically amplified resists

Photoresist processing

Product distribution

3D modeling

3D image processing

Molecules

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