Temperature dependence of UV-induced compaction in fused silica

Fan Piao; Richard E. Schenker; William G. Oldham

doi:10.1117/12.276046

7 July 1997 Temperature dependence of UV-induced compaction in fused silica

Fan Piao, Richard E. Schenker, William G. Oldham

Proceedings Volume 3051, Optical Microlithography X; (1997) https://doi.org/10.1117/12.276046
Event: Microlithography '97, 1997, Santa Clara, CA, United States

Abstract

Different 1995 - 1996 grade experimental fused silica samples were evaluated for their resistance to UV-induced compaction at 193 nm under elevated sample temperature conditions. Stress induced birefringence was used as a sensitive compaction monitor. We found that compaction rate decreases with increasing sample temperature. Isochronal annealing experiments were performed on two different sets of pre-damaged fused silica samples. Annealing of compaction was observed at temperatures as low as 200 degree(s)C, and an activation energy of 0.1 eV was found.

Citation Download Citation

Fan Piao, Richard E. Schenker, and William G. Oldham "Temperature dependence of UV-induced compaction in fused silica", Proc. SPIE 3051, Optical Microlithography X, (7 July 1997); https://doi.org/10.1117/12.276046

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available