3D-deformation analysis of microcomponents using digital holography

Soenke Seebacher; Wolfgang Osten; Werner P. O. Jueptner

doi:10.1117/12.281183

17 September 1997 3D-deformation analysis of microcomponents using digital holography

Soenke Seebacher, Wolfgang Osten, Werner P. O. Jueptner

Proceedings Volume 3098, Optical Inspection and Micromeasurements II; (1997) https://doi.org/10.1117/12.281183
Event: Lasers and Optics in Manufacturing III, 1997, Munich, Germany

Abstract

Holographic interferometry is widely used as contactless method in experimental mechanics and non-destructive testing of materials and engineering components. But measuring the full 3D-deformation of the object's surface requires a complicated optical setup with at least three different illumination directions.Especially if micro-components with lateral extensions less than 10mm have to be examined the simple use of conventional holography becomes more and more a problem. Since high resolution CCD cameras are available for reasonable prices, digital holography can be used as a fast, easy and precise method for holographic interferometry. Compact and simple setups can be achieved by the use of fiber optics. Digital holography replaces the holographic plate by a CCD matrix. No additional magnifying optical components are needed to achieve lateral resolutions of about 5 micrometers and deformation resolution of 15nm. Some experiments using four illumination direction in an optimized setup are presented. They show the 3D-deformation fields of small objects under a given load. The results are compared with computer simulations to receive material parameters.

Citation Download Citation

Soenke Seebacher, Wolfgang Osten, and Werner P. O. Jueptner "3D-deformation analysis of microcomponents using digital holography", Proc. SPIE 3098, Optical Inspection and Micromeasurements II, (17 September 1997); https://doi.org/10.1117/12.281183

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