Moire interferometry/termovision method for electronic package testing

Leszek A. Salbut; Malgorzata Kujawinska

doi:10.1117/12.281157

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17 September 1997 Moire interferometry/termovision method for electronic package testing

Leszek A. Salbut, Malgorzata Kujawinska

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Proceedings Volume 3098, Optical Inspection and Micromeasurements II; (1997) https://doi.org/10.1117/12.281157
Event: Lasers and Optics in Manufacturing III, 1997, Munich, Germany

Abstract

The method combining moire interferometry and termovision techniques (MI/T) for thermally loaded elements testing is proposed. The methodology of the MI/T method applied for simultaneous in-plane displacement/strain and temperature distributions monitoring and measurement at electronic elements is described. The results of thermal tests performed at electronic chip UCY74S405N are presented.

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Leszek A. Salbut and Malgorzata Kujawinska "Moire interferometry/termovision method for electronic package testing", Proc. SPIE 3098, Optical Inspection and Micromeasurements II, (17 September 1997); https://doi.org/10.1117/12.281157

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