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22 September 1997 Precision molding techniques for optical waveguide devices
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Abstract
Single-mode optical waveguide devices with integrated fiber- alignment grooves have been fabricated by injection molding of structured substrates and by subsequent filling of the waveguide channels with higher refractive index polymer. The master forms of the microstructures have been micro-machined channels with higher refractive index polymers. The master forms of the microstructures have been micro-machined in silicon. A special injection molding tool has been developed to yield plastic substrate chips with high surface planarity and replicated microstructures with details in the submicron range. Hot embossing is a further technology applied for the fabrication of large area waveguide devices with integrated mirrors, mainly intended for optical backplane applications. The hot embossing tool is driven on an injection molding machine which is a more cost effective method than the acquisition of conventional hot embossing equipment. In this paper, the injection molding as well as the hot embossing tool will be described together with the process and the results in the field of passive components for optical telecommunications and datacommunications.
© (1997) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Stefan Kalveram and Andreas Neyer "Precision molding techniques for optical waveguide devices", Proc. SPIE 3135, Precision Plastic Optics for Optical Storage, Displays, Imaging, and Communications, (22 September 1997); https://doi.org/10.1117/12.279141
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