Reversible low-temperature direct bonds for fabrication of three-dimensional microelectronic structures

Robert W. Bower; Albert Li

doi:10.1117/12.280562

18 August 1997 Reversible low-temperature direct bonds for fabrication of three-dimensional microelectronic structures

Robert W. Bower, Albert Li

Proceedings Volume 3184, Microelectronic Packaging and Laser Processing; (1997) https://doi.org/10.1117/12.280562
Event: ISMA '97 International Symposium on Microelectronics and Assembly, 1997, Singapore, Singapore

Abstract

This paper describes the formation and application of reversible low temperature bonds for fabrication of 3D microelectronic structures. The basis of this reversible bond is a three-step low temperature bonding process. This tree-step process consists of 1) pressure, 2) pressure and temperature and 3) temperature. The first and second steps of this process create a uniform, void free, weak bond that can be easily severed. The third step consists of a long anneal at 200 degrees C that creates a bond of strength greater than 1000 ergs/cm². The reversibility and reusability of a bond processed through the first and second step of the three-step process is investigated in this paper.

Citation Download Citation

Robert W. Bower and Albert Li "Reversible low-temperature direct bonds for fabrication of three-dimensional microelectronic structures", Proc. SPIE 3184, Microelectronic Packaging and Laser Processing, (18 August 1997); https://doi.org/10.1117/12.280562

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available